Figure 9From: Improved parameter targeting in 3D-integrated superconducting circuits through a polymer spacer processEdge-on SEM micrographs of one corner of a flip-chip bonded device: (a) In-lens detector, secondary electrons. The cursor height, corresponding to the measured separation and indicated by the pink bar, is 10.90 μm. (b) Secondary electron detector. The cursor height is 10.80 μmBack to article page