Table 1 Mechanical measurement results. Samples A1 through M3 have spacers unless noted otherwise. Samples N1 through N4 have no spacers. \(p_{\mathrm{b}}\): bonding pressure, \(c - t_{\mathrm{w,est}}\): fit plane height minus estimated wafer thickness (from independent measurements), θ: fit plane polar angle, ϕ: fit plane azimuthal angle

From: Improved parameter targeting in 3D-integrated superconducting circuits through a polymer spacer process